Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects
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概要
- 論文の詳細を見る
Low-resistance metal contacts for CVD-nanocarbon (NC)/cobalt (Co) interconnects have been investigated among contact metals such as Ni, Ti, Au, and Cu. Contact resistivity was independent of contact area owing to low-resistance NC/Co interconnect structure. The lowest contact resistivity and superior adhesion were obtained from Ni. Although the factors for the low contact resistivity were not clear enough from the comparison of work-function difference and adhesion strength for the contact metals, Ni is a promising low-resistivity contact metal for CVD-NC interconnects in the future.
- 2013-05-25
著者
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UENO Kazuyoshi
Shibaura Institute of Technology, Dept. of Electronic Engineering
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YAMAZAKI Yuichi
Low-Power Electronics Association and Project (LEAP)
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KAJITA Akihiro
Low-Power Electronics Association and Project (LEAP)
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Sakai Tadashi
Low-power Electronics Association & Project (LEAP), Kawasaki 212-8582, Japan
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Sakuma Naoshi
Low-Power Electronics Association and Project (LEAP), Tsukuba, Ibaraki 305-8569, Japan
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Sakuma Naoshi
Low-power Electronics Association & Project (LEAP), Tsukuba, Ibaraki 305-8569, Japan
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Takagi Masashi
Shibaura Institute of Technology, Koto, Tokyo 135-8548, Japan
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Yano Hiroaki
Shibaura Institute of Technology, Koto, Tokyo 135-8548, Japan
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Wakui Taichi
Shibaura Institute of Technology, Koto, Tokyo 135-8548, Japan
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Yamazaki Yuichi
Low-Power Electronics Association and Project (LEAP), Tsukuba, Ibaraki 305-8569, Japan
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