Fabrication and Characterization of Planarized Carbon Nanotube Via Interconnects (Special Issue : Advanced Metallization for ULSI Applications)
スポンサーリンク
概要
著者
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YAMAZAKI Yuichi
Low-Power Electronics Association and Project (LEAP)
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WADA Makoto
Low-Power Electronics Association and Project (LEAP)
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KITAMURA Masayuki
Low-Power Electronics Association and Project (LEAP)
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KATAGIRI Masayuki
Low-Power Electronics Association and Project (LEAP)
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SAITO Tatsuro
Low-Power Electronics Association and Project (LEAP)
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ISOBAYASHI Atsunobu
Low-Power Electronics Association and Project (LEAP)
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SUZUKI Mariko
Low-Power Electronics Association and Project (LEAP)
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SAKATA Atsuko
Low-Power Electronics Association and Project (LEAP)
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KAJITA Akihiro
Low-Power Electronics Association and Project (LEAP)
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Sakai Tadashi
Low-power Electronics Association & Project (LEAP), Kawasaki 212-8582, Japan
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Sakuma Naoshi
Low-power Electronics Association & Project (LEAP), Tsukuba, Ibaraki 305-8569, Japan
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Ito Ban
Low-power Electronics Association & Project (LEAP), Tsukuba, Ibaraki 305-8569, Japan
関連論文
- Carbon Nanotube Vias Fabricated by Remote Plasma-Enhanced Chemical Vapor Deposition
- Synthesis of a Closely Packed Carbon Nanotube Forest by a Multi-Step Growth Method Using Plasma-Based Chemical Vapor Deposition
- High-Quality Carbon Nanotube Growth at Low Temperature by Pulse-Excited Remote Plasma Chemical Vapor Deposition
- Fabrication and Characterization of Planarized Carbon Nanotube Via Interconnects (Special Issue : Advanced Metallization for ULSI Applications)
- A Study on Electrical Resistance of Carbon Nanotubes and Their Metal Contacts Using Simplified Test Structure (Special Issue : Advanced Metallization for ULSI Applications)
- Low-Temperature Graphene Growth Originating at Crystalline Facets of Catalytic Metal
- Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects
- Electrical Resistivity Measurements of Layer Number Determined Multilayer Graphene Wiring for Future Large Scale Integrated Circuit Interconnects
- Heat-Resistant Co--W Catalytic Metals for Multilayer Graphene Chemical Vapor Deposition
- Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects (Special Issue : Advanced Metallization for ULSI Applications)
- Electrical Resistivity Measurements of Layer Number Determined Multilayer Graphene Wiring for Future Large Scale Integrated Circuit Interconnects (Special Issue : Microprocesses and Nanotechnology)