Direct Writing of Resist Patterns Using a Wire Nozzle Newly Developed for an Air-Pressure Dispenser
スポンサーリンク
概要
- 論文の詳細を見る
Direct writing of resist patterns using an air-pressure dispenser is expected as a low-cost patterning method for fabricating various microdevices. However, it was difficult to smoothly delineate fine resist patterns with a width of less than 100 μm when a commercial air-pressure dispenser system was used, because high-viscosity resists block fine dispenser nozzles, and low-viscosity resists spread after they are dispensed. For this reason, a new wire-nozzle dispenser was developed to write fine resist patterns with a width of less than 100 μm. The technology is especially suitable for customized small-scale productions. In the experiments, patterns were delineated onto wafers and copper-clad plastic substrates using the new wire-nozzle dispenser with an inner diameter of 100 μm and a wire diameter of 30 μm. As a result, straight line patterns with a minimum width of 50 μm were successfully delineated using a resist PMER P-LA900PM with a viscosity of 1500 mPa$\cdot$s. Patterns circularly curved with a radius of 1 mm and a width of 130 μm were also smoothly delineated. In addition, microreactor patterns including a joint point and curved shapes were successfully written. Although the linewidths at the curved parts slightly differed from those at the straight parts, all the patterns were smoothly stitched. Moreover, complicated patterns with variously curved routes were also successfully delineated. It was verified that the newly developed wire nozzle was useful as a new dispenser tool.
- 2010-06-25
著者
-
Horiuchi Toshiyuki
Tokyo Denki Univ. Tokyo Jpn
-
Toshiyuki Horiuchi
Tokyo Denki University, 2-2 Kandanishikicho, Chiyoda, Tokyo 101-8457, Japan
-
Shinichiro Ohtsuka
Tokyo Denki University, 2-2 Kandanishikicho, Chiyoda, Tokyo 101-8457, Japan
-
Ohtsuka Shinichiro
Tokyo Denki University, 2-2 Kandanishikicho, Chiyoda, Tokyo 101-8457, Japan
関連論文
- Half Wavelength Pattern Replization Using a Projection Lens with an Ultra High Numerical Aperture and Thin Resist Process
- A New Projection Exposure Method Using a Liquid Crystal Display as a Switching Matrix in Place of a Reticle
- Novel Laser Scan Lithography onto Deep Inside Surfaces of Fine Pipes Using a Reflection Rod
- Helical Patterning onto Fine Pipes and Fabrication of Long Microcoils
- New Projection Exposure Using a Double-line Matrix of Optical Fibers in Place of a Reticle
- Curved Resist Surface Fabrication by Scanning a Blue Laser Beam With Positional Dose Distribution : Instrumentation, Measurement, and Fabrication Technology
- Application of Matrix Projection Exposure Using a Liquid Crystal Display Panel to Fabricate Thick Resist Molds
- Optical-Fiber-Matrix Exposure Using Light-Emitting-Diode Sources
- Multi-layer Resist Process Using Top-layer Resist as Phase Shifters
- New-Projection Exposure Using a Double-line Matrix of Optical Fibers in Place of a Reticle
- New Laser-Scan Exposure System for Delineating Precise Helical Patterns onto Sub-50-μmWires (Special Issue : Microprocesses and Nanotechnology)
- Gradation Stitching Exposure for Step-and-Scan Projection Printing System
- Fabrication of Nickel Microlens Dies Using Hemispherical Resist Patterns as Electroplating Molds (Special Issue : Microprocesses and Nanotechnology)
- Direct Writing of Resist Patterns Using a Wire Nozzle Newly Developed for an Air-Pressure Dispenser
- Gradation Stitching Exposure Performance in the Improvement of Dose Uniformity and Continuity at the Field Stitching Boundaries
- Novel Exposure System Using Light-Emitting Diodes and an Optical Fiber Array for Printing Code Marks
- Matrix Projection Exposure Using an Analogue Liquid Crystal Display Panel in Place of a Reticle
- Novel Projection Exposure System Using Gradient-Index Lens Array