Role of Annealing in Constant Period of Voltage Stress on the Burn-in Effect Suppression of InGaP/GaAs Heterojunction Bipolar Transistors
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概要
- 論文の詳細を見る
Rapid thermal annealing (RTA) is proved to be more efficient in dissociating hydrogen complexes than using a constant period of voltage stress (CPVS). Without waiting for the bond breaking of complexes by minority carrier injection, RTA favors the critical base–emitter voltage ($V_{\text{BE}}$) responsible for the occurrence of burn-in (BI) from 1.75 to 1.4 V and thus assists CPVS in reducing $V_{\text{BE}}$ by about 25% used in BI suppression. Besides eliminating the BI, the sample first prepared by RTA and followed by CPVS has larger base and collector current densities at $V_{\text{BE}}>1.1$ V and reaches 6 times those at $V_{\text{BE}}>1.3$ V compared with the sample only using by CPVS.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2007-03-15
著者
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Houng Mau-phon
Institute Of Microelectronics Department Of Electrical Engineering National Cheng Kung University
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Jenq Fenq-lin
Department Of Electrical Engineering National Tsing Hua University
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Chong Kwok-Keung
Department of Microelectronic Engineering, National Kaoshiung Marine University, 142 Hai-Chuan Road, Nan-Tzu, Kaohsiung 811, Taiwan
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Houng Mau-Phon
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, 1 University Road, Tainan 701, Taiwan
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