High-Spatial-Resolution Machining Utilizing Atmospheric Pressure Plasma: Machining Characteristics of Silicon
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概要
- 論文の詳細を見る
By applying atmospheric-pressure plasma, we have developed a new ultraprecision machining method named plasma chemical vaporization machining (PCVM). In this method, several types of rotary or pipe electrode are prepared for optimizing the required machining characteristics. In particular, by rotating the electrodes in a high-pressure environment, both the supply of reactive species to the machining point and the exhaust of reaction products are effectively performed. To realize high-efficiency ultraprecision machining, optimum removal that corresponds to various spatial wavelengths should be performed. The spatial resolution range of the rotary electrode is 10–20 mm, and that of the pipe electrode is 1–2 mm. Therefore, the development of a new machining method that has a spatial resolution on the submillimeter order is required. In this paper, we propose a new machining method in which reactive species generated in atmospheric-pressure plasma are supplied to the workpiece surface through a small orifice with a diameter of 10 μm. We also report the machining characteristics of Si.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2006-10-30
著者
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YAMAMURA Kazuya
Research Center for Ultra-precision Science and Technology, Graduate School of Engineering, Osaka Un
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SANO Yasuhisa
Division of Precision Science and Technology and Applied Physics, Graduate School of Engineering, Os
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SHIBAHARA Masafumi
Department of Product Innovation, Hyogo Prefectural Institute of Technology
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Mori Yuzo
Research Center For Ultra-precision Science And Technology Osaka University
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Kato Kunihito
Division Of Precision Science And Technology And Applied Physics Graduate School Of Engineering Osak
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Endo Katsuyoshi
Research Center For Ultra-precision Science And Technology Graduate School Of Engineering University
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Kato Kunihito
Division of Precision Science and Technology and Applied Physics, Graduate School of Engineering, Osaka University, Yamadaoka 2-1, Suita, Osaka 565-0871, Japan
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