Metalorganic Chemical Vapor Deposition of HfO2 Films through the Alternating Supply of Tetrakis(1-methoxy-2-methyl-2-propoxy)-Hafnium and Remote-Plasma Oxygen
スポンサーリンク
概要
- 論文の詳細を見る
Thin films of hafnium oxide were deposited by sequence in which the supply of tetrakis (1-methoxy-2-methyl-2-propoxy)-hafnium and remote-plasma oxygen were alternated. Increasing the number of cycles of alternating supply led to decreased amounts of hydrocarbon impurities in the film and the realization of an amorphous characteristic for the as-deposited films. HfO2 dielectric capacitors produced by using this alternating supply technique exhibit values for leakage current that are two orders of magnitude lower than those of capacitors produced using the conventional process of metalorganic chemical vapor deposition. This effective improvement can be explained by the reduced presence of impurities, particularly H2O.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-08-15
著者
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Niwa Masaaki
Ulsi Process Technology Development Center Semiconductor Company Matsushita Electric Industrial Co.
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Miya Hironobu
Semiconductor Equipment Division Hitachi Kokusai Electric Inc.
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Horii Sadayoshi
Semiconductor Equipment System Laboratory Hitachi Kokusai Electric Inc.
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Asai Masayuki
Semiconductor Equipment System Laboratory Hitachi Kokusai Electric Inc.
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Niwa Masaaki
ULSI Process Technology Development Center, Matsushita Electric Industrial Co., Ltd., 19 Nishikujo-Kasugacho, Minami-ku, Kyoto 601-8413, Japan
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Yamamoto Kazuhiko
ULSI Process Technology Development Center, Matsushita Electric Industrial Co., Ltd.
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