Using Planarized p-GaN Layer to Reduce Electrostatic Discharged Damage in Nitride-Based Light-Emitting Diode
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概要
- 論文の詳細を見る
Electrostatic discharge damage is a serious problem on nitride-based light-emitting diodes (LEDs), due to their large lattice mismatch between III–nitride material and the sapphire substrate, which induces high-density threading dislocations. In this study, GaN/GaInN-based LEDs with various thicknesses of the low-temperature planarized p-GaN layer were fabricated. We found that when the V-shaped defects were filled by the planarized p-GaN layer, the survival rate of LEDs under human-body mode $-4000$ V stress increases from 23 to 93% and the survival rate under machine mode $-600$ V stress increases from 20 to 67%. Thus the ability to endure higher electrostatic discharge stress will be greatly improved.
- Japan Society of Applied Physicsの論文
- 2007-05-25
著者
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LEE Chi-Ling
Department of Electrophysics, and Microelectronics and Information Systems Research Center, National
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Lee Wei-i
Department Of Electrophysics And Microelectronics And Information Systems Research Center National C
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Lee Chi-Ling
Department of Electrophysics, National Chiao Tung University, Hsinchu 30010, Taiwan, R.O.C.
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Lee Wei-I
Department of Electrophysics, National Chiao Tung University, Hsinchu 30010, Taiwan, R.O.C.
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- Using Planarized p-GaN Layer to Reduce Electrostatic Discharged Damage in Nitride-Based Light-Emitting Diode
- A Simple Growth Method to Produce a-Plane GaN Thick Films by Hydride Vapor Phase Epitaxy