Hydrogenation Effects on Chemical Activity of Defects in Excimer-Laser-Annealed Polycrystalline Silicon Thin Films
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概要
- 論文の詳細を見る
The hydrogenation effects on the chemical activity of defects in excimer-laser-annealed polycrystalline silicon (poly-Si) thin films were investigated by Secco etching, scanning electron microscopy, and Raman spectroscopy. In the case of as-crystallized poly-Si films, defects at grain boundaries (GBs) and in grains were preferentially etched. It was found that the tensile stress in poly-Si films was pronouncedly relieved by etching, which is attributed to the penetration of the etching solution to the interface between the poly-Si films and the SiO2 underlayers. In the case of sufficiently hydrogenated poly-Si films, no preferential etching at GBs and almost no relief of stress was found until disappearance of the poly-Si film. The hydrogenation effects on the chemical activity were attributed to the passivation of dangling bonds at GBs and in grains. The results of the analysis of Raman intensity for various film thicknesses were also shown.
- Japan Society of Applied Physicsの論文
- 2007-05-25
著者
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KITAHARA Kuninori
Interdisciplinary Faculty of Science and Engineering, Shimane University
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Kitahara Kuninori
Interdisciplinary Graduate School of Science and Engineering, Shimane University, 1060 Nishikawatsu, Matsue 690-8504, Japan
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Ohashi Yasutaka
Interdisciplinary Graduate School of Science and Engineering, Shimane University, 1060 Nishikawatsu, Matsue 690-8504, Japan
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Matsumoto Shin
Interdisciplinary Graduate School of Science and Engineering, Shimane University, 1060 Nishikawatsu, Matsue 690-8504, Japan
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