シリコン単結晶成長プロセスの数値シミュレーションに要求される熱物性値(<小特集>バルク成長分科会特集-最先端デバイスと科学技術-)

概要

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Thermophysical properties required for numerical simulation of silicon crystal growth processes have been investigated from Japanese silicon wafer producers. Results from the survey are presented for molten silicon, crystalline silicon and refractory materials. Thermal transport properties such as thermal conductivity of both melt and crystal are greatly important. Mechanical properties such as elastic constant of the crystal are required especially at high temperatures. Thermal transport properties of refractory materials are also essential for the global analysis of heat transfer in the furnace. However, refractory data have been kept confidential.
日本結晶成長学会の論文
2004-01-15