Highly miniaturized on-chip passive circuits on silicon substrate for application to wireless communication system (無線通信システム)
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概要
- 論文の詳細を見る
In this study, we propose a highly miniaturize on-chip 90° Hybrid Coupler on radio frequency integrated circuit (RFIC), which was fabricated by a coplanar line employing periodically arrayed grounded-strip structure (PAGS). Using the coplanar waveguide employing PAGS, we realized a miniaturized 90° hybrid coupler on Silicon RFIC. The 90° Hybrid Coupler exhibited good performances from 41.75 to 50 GHz, and its size was 0.46 x 0.55 mm^2 , which is 37 % of conventional one.
- 社団法人電子情報通信学会の論文
- 2010-01-14
著者
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Park Young-Bae
Department of Internal Medicine, Seoul National University College of Medicine
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Yun Young
Department Of Electrical Engineering Faculty Of Engineering Science Osaka University
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Park Young-bae
Department Of Radio Communication Engineering Korea Maritime University
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Park Young-bae
Department Of Internal Medicine College Of Medicine Scoul National University
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Jung Jang-hyeon
Department Of Radio Communication Engineering Korea Maritime University
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Kang Suk-youb
Department Of Radio Communication Engineering Korea Maritime University
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Yun Young
Department Of Radio Communication Engineering Korea Maritime University
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Jung Bo-ra
Department Of Radio Communication Engineering Korea Maritime University
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Kim Se-ho
Department Of Radio Communication Engineering Korea Maritime University
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Jur Jeong-Gab
Department of Radio Communication Engineering, Korea Maritime University
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Ju Jeong-gab
Department Of Radio Communication Engineering Korea Maritime University
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Yun Young
Department Of Earth And Planetary Sciences School Of Science Tokyo Institute Of Technology
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Kang Suk‐youb
Department Of Radio Communication Engineering Korea Maritime University
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Kim Se-Ho
Department of Electronic Materials Engineering, Kwangwoon University, Seoul 139-701, Korea
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YUN Young
Korea Maritime University
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Park Young-Bae
Department of Internal Medicine and Cardiovascular Center, Seoul National University Hospital
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