Electron Devices Fabricated On Diamond Film Surface For Application To Hard Electronics
スポンサーリンク
概要
- 論文の詳細を見る
In this paper, basic electrical properties of semiconducting diamond devices were investigated for application to hard electronics. Concretely, I-V characteristics of diamond FET was investigated, and electrical property of amplifier employing diamond FET was characterized. In addition, trap level of diamond film surface was also characterized using pulsed laser irradiation for application to laser emitting diode.
- 2012-05-17
著者
-
HAN Sung-Jo
Korea Maritime University
-
Jeong Jang-Hyeon
Korea Maritime University Dept. of Radio Communication Engineering
-
JEONG Jang-Hyeon
Korea Maritime University
-
Jang Eui-Hoon
Korea Maritime University Dept. of Radio Communication Engineering
-
Yun Young
Korea Maritime University Dept. of Radio Communication Engineering
-
Son Ki-Joon
Korea Maritime University Dept. of Radio Communication Engineering
-
YUN Young
Korea Maritime University
-
JANG Eui-Hoon
Korea Maritime University
関連論文
- Highly miniaturized on-chip passive circuits on silicon substrate for application to wireless communication system (無線通信システム)
- Highly miniaturized on-chip passive circuits on silicon substrate for application to wireless communication system (信号処理)
- A highly miniaturized broadband on-chip impedance transformer employing periodically arrayed ground structure on silicon substrate for application to broadband wireless access system (無線通信システム)
- A study on equivalent circuit of short wavelength transmission line employing periodic structure on semiconducting substrate for application to circuit design of wireless communication system (無線通信システム)
- Ultra-compact integrated circuits for Ku-band wireless communication system (無線通信システム)
- A highly miniaturized broadband on-chip impedance transformer employing periodically arrayed ground structure on silicon substrate for application to broadband wireless access system (信号処理)
- A study on equivalent circuit of short wavelength transmission line employing periodic structure on semiconducting substrate for application to circuit design of wireless communication system (信号処理)
- Ultra-compact integrated circuits for Ku-band wireless communication system (信号処理)
- A Gate Mixer Employing 0.18μm CMOS Technology for Application to Vehicle Safety Warning System
- A gate mixer employing 0.18 μm CMOS technology for application to vehicle safety warning system (マイクロ波)
- Study on diamond thin film semiconducting devices for application to a development of hard-electronics high frequency driving circuit (マイクロ波)
- Dependency of RF performances of transmission line employing PPGM on ground condition (マイクロ波)
- A Fully Integrated Downconverter MMIC for Millimeter Wave Applications (回路とシステム)
- A Highly Miniaturized Voltage Controlled Impedance Transformer Employing Periodically Arrayed InGaP/GaAs Diodes for Application to Matching Components on MMIC
- A Miniaturized Millimeter Wave Singly Balanced Mixer Including Input/Output Baluns On MMIC
- An Experimental and Theoretical Investigation on Basic Characteristics of Transmission Line Employing 3D Capacitive Coupling Structure
- Electron Devices Fabricated On Diamond Film Surface For Application To Hard Electronics
- Study on RF Characteristics of Transparent Flexible Substrate
- Development of Miniaturized RF Passive Devices on Flexible Substrate
- A Highly Miniaturized Voltage Controlled Impedance Transformer Employing Periodically Arrayed InGaP/GaAs Diodes for Application to Matching Components on MMIC
- Electron Devices Fabricated On Diamond Film Surface For Application To Hard Electronics