Solid-State Reaction Bonding of Alumina to Cu-4Ti Alloy(Materials, Metallurgy & Weldability)
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概要
- 論文の詳細を見る
The solid-state reaction bonding of alumina ceramics to Cu-4Ti alloy was studied. The bonding was carried out in a vacuum (7×10^<-3>Pa) by changing bonding temperture. The bonding strength of alumina/Cu-4Ti alloy joints is bigger than the bonding strength of alumina/Cu joints. During the solid-state reaction bonding of alumina ceramics to Cu-4Ti alloy, Ti has been condensed at Al_2O_3/Cu-4Ti alloy interface. By assuming the formation of Ti-Al bi-alloy by the reduction of Al_2O_3 by Ti, it is shown that Ti-Al complex oxide can be produced at the bonding interface from thermodynamic calculation.
- 大阪大学の論文
著者
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Arata Y
Osaka Univ. Osaka Jpn
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ARATA Yoshiaki
Osaka University
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OHMORI Akira
Osaka University
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Sano Saburo
Ceramics Research Inst., National Inst. of Advanced Industrial Science and Tech.
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Sano Saburo
Osaka University
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WLOSINSKI Wladyslow
Osaka University
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Wlosinski Wladyslow
Osaka University:warsaw Technical University
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