Bonds in CdSiP_2 Studied by Thermal Expansion Coefficients

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概要

• 論文の詳細を見る
• 社団法人応用物理学会の論文
• 1978-09-05

著者

• NAKAU Tanehiro

  Department of Electronics, University of Osaka Prefecture

• NIMURA Hiroshi

  Department of Surgery, Jikei University School of Medicine

• Nimura Hiroshi

  Department Of Electronic Engineering College Of Engineering University Of Osaka Prefecture

• Nakau Tanehiro

  Department Of Electronic Engineering College Of Engineering University Of Osaka Prefecture

• Kamada Seiji

  Department Of Electronic Engineering College Of Engineering University Of Osaka Prefecture

• Ozaki Yoshiharu

  Department Of Electronic Engineering College Of Engineering University Of Osaka Prefecture:(present

• HISAMATSU Tadashi

  Department of Electronic Engineering, College of Engineering, University of Osaka Prefecture

• Hisamatsu Tadashi

  Department Of Electronic Engineering College Of Engineering University Of Osaka Prefecture

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