A Multilevel Interconnect Technology with Intrametal Air Gap for High-Performance 0.25-μm-and-Beyond Devices Manufacturing
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1999-11-15
著者
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Chang Chun
Institute Of Electronics National Chiao Tung University
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CHANG Chun
National Nano Device Laboratory and Institute of Electronics National Chiao-Tang University
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Huang T
National Chiao Tung Univ. Taiwan Chn
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Huang Tiao
Institute Of Electronics National Chiao Tung University
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Chang C
National Nano Device Laboratory
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LIN Mark
Institute of Electronics, National Chiao Tung University
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Lin Mark
Institute Of Electronics National Chiao Tung University
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LIN Mout-Lim
United Semiconductor Corp
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