Experimental and Numerical Verification of Fatigue Life Estimation for Solder Bumps

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概要

• 論文の詳細を見る

• Fatigue life estimation of solder bumps is one of the most critical technologies for the development of ball grid array packages. In this study, mechanical fatigue tests were carried out using Sn63-Pb37 solder bump specimens. The cracks were initiated along the entire circumference in the vicinity of the interface. The fatigue life estimation of the solder bumps was performed based on the elastic-creep finite element method (FEM) analysis. It was clear that the strain concentration region coincides with the crack initiation site. The estimation result for the crack initiation was in good agreement with the experimental results. The results reconfirmed that it was desirable to employ the equivalent creep strain range occurring at a distance of 50μm from the singularity point. The life ratio, which provides the quantitative correlation between the crack initiation and the ultimate fracture, was determined from the experimental results. The number of cycles to the fatal failure can be roughly estimated by multiplying the analytical estimation results for the crack initiation by this life ratio. This simple estimation of fatal failure may well be of practical use in actual ball grid array (BGA) design for thermal load conditions.

• 一般社団法人日本機械学会の論文
• 2001-10-15

著者

• KISHIMOTO Kikuo

  Department of Mechanical and Control Engineering, Tokyo Institute of Technology

• TAKAHASHI Hiroyuki

  Research into Artifacts, Center for Engineering, The University of Tokyo

• Kishimoto Kikuo

  Department Of Mechanical And Control Engineering Tokyo Institute Of Technology

• Shibuya T

  Department Of Mechanical And Intelligent Systems Engineering Tokyo Institute Of Technology

• Shibuya T

  National Inst. Multimedia Education Chiba Jpn

• MUKAI Minoru

  Research and Development Center, Toshiba Corporation

• KAWAKAMI Takashi

  Research and Development Center, Toshiba Corporation

• TAKAHASHI Kuniaki

  Digital Media Network Company, Toshiba Corporation

• IWASAKI Ken

  Semiconductor Company, Toshiba Corporation

• SHIBUYA Toshikazu

  Department of Mechanical and Intelligent Systems Eng., Tokyo Institute of Technology

• Mukai Minoru

  Research And Development Center Toshiba Corporation

• Iwasaki Ken

  Semiconductor Company Toshiba Corporation

• Takahashi Kunihiro

  Research And Development Center Toshiba Corporation

• Takahashi Hiroyuki

  Research Center For Advanced Science And Technology. The University Of Tokyo

• Shibuya Toshikazu

  Department Of Engineering Tokyo Institute Of Technology

• Takahashi Hiroyuki

  Research And Development Center Toshiba Corporation

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