Thermal Fatigue Life of Solder Bumps in BGA
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概要
- 論文の詳細を見る
Fatigue life estimation of solder bumps is one of the most critical technologies for the development of ball grid array packages(BGA). In this study, strain singularity was examined based on the analytical results for the primary solder bump model. The result suggested that it was desirable to employ the equivalent creep strain range occurring at a distance of 0.05 mm from the singularity point. The fatigue life estimation of the actual solder bumps was performed based on this consideration. The estimation result for the crack initiation was in good agreement with the experimental results. A simple estimation of the crack propagation based on the linear damage law was also proposed for convenience' sake. The trend of the simple estimation results corresponded well with the experimental results of crack propagation. Therefore, the fatigue life estimation of solder bumps based on the present method is satisfactory for engineering purposes.
- 一般社団法人日本機械学会の論文
- 1998-04-15
著者
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Shibuya T
Department Of Mechanical And Intelligent Systems Engineering Tokyo Institute Of Technology
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Shibuya T
National Inst. Multimedia Education Chiba Jpn
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MUKAI Minoru
Research and Development Center, Toshiba Corporation
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MUKAI Minoru
Energy and Mechanical Research Laboratories, Research and Development Center
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KAWAKAMI Takashi
Energy and Mechanical Research Laboratories, Research and Development Center
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TAKAHASHI Kuniaki
Ome Works, Toshiba Corporation
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KISHIMOTO Kikuo
Dept.of Mechanical and Intelligent Systems Eng., Tokyo Institute of Technology
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SHIBUYA Tosikaz
Dept.of Mechanical and Intelligent Systems Eng., Tokyo Institute of Technology
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Mukai Minoru
Research And Development Center Toshiba Corporation
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Takahashi Kunihiro
Research And Development Center Toshiba Corporation
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KISHIMOTO Kikuo
Dept. of Mech. Sci. Eng., Tokyo Inst. Tech.
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