Transient Thermal Stresses in a Half Plane with a Crack Parallel to the Surface
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概要
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Transient thermal stresses in a half plane with a crack parallel to the surface are investigated. It is assumed that the half plane is initially at uniform temperature, and subjected to stepwise temperature rise on the surface. The problem is formulated as integral equations. From their numerical solutions, variations of the stress intensity factors with time are obtained.
- 一般社団法人日本機械学会の論文
著者
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Takakuda Kazuo
Tokyo Institute Of Technology
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Koizumi Takashi
Tokyo Institute Of Technology
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Shibuya T
Department Of Mechanical And Intelligent Systems Engineering Tokyo Institute Of Technology
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Shibuya T
National Inst. Multimedia Education Chiba Jpn
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Shibuya Toshikazu
Tokyo Inst. Tech.
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TSUJI Tomoaki
Tokyo Institute of Technology
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Koizumi Takashi
Tokyo Inst. Tech.
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