E216 P-BG搭載プリント板における放熱経路の評価(オーガナイズドセッション21 : 電子機器の熱設計と解析の応用)

概要

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As the miniaturization of mobile pc is advanced, an efficient cooling technology is necessary. For quick development of the cooling technology, the heat design which use the CFD code are keys. When heat is simulated at the device level and the system level, the heat transfer and the radiation from the surface, and the heat conduction in side the package are important, and details of the heat simulation model greatly influence the simulation accuracy. We worked on the simulation of P-BGA, and made the comparison and the verification with the experimental value. P-BGA is packaged on high and low heat conduction board, and thermal resistance is measured in natural and compulsion air cooling environment. Moreover, we analyzed the heat path and we reports on it.
2001-11-03