K-0643 鉛フリーはんだ接合部の界面強度に及ぼす熱時効の影響(S06-4 界面強度と高温強度)(S06 コーティング材の力学特性と損傷機構)

概要

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Recently, preventing environmental pollutions, lead-free (Pb-free) solders are widely used instead of conventional lead-tin (Pb-Sn) eutectic solders. However, the mechanical properties of Pb-free solders have not been clarified. Intermetallic compounds are formed during reflow process between solder and electrical pads and gradually grow in service. Due to it's brittle manner, the reliability of solder joints are supposed to degenerate. By using the Cu-plates on which Cu, Ni or Ni+Au plating was deposited, and Pb-free solders (Sn-Ag-Cu solders), the specimen of solder joints were fabricated. After aging it in an isothermal chamber, tensile tests were performed and the relationships between solder joint strength and aging period were considered. From SEM microscope observation and EDX microprobe analysis, the growth and components of the intermetallic compounds layer were also examined.
一般社団法人日本機械学会の論文
2001-08-22