種々の板厚をもつ異材接合板の三次元FEM応力解析

概要

論文の詳細を見る
The stress distributions induced by an applied stress σ_0 in five bonded plate specimens (silicon nitride to copper) with different thicknesses were calculated by using the three-dimensional (3-D) finite element method (FEM) stress analysis and the results were compared with those of the two-dimensional (2-D) FEM stress analysis. Along the center line perpendicular to the interface on the surface of the specimen, a maximum stress of approximately 1.3σ_0 calculated with the 3-D FEM appeared in the interfacial region in silicon nitride, with a minimum stress of 0.9σ_0 appearing in copper ; these values were almost independent of the thickness of the specimen. On the other hand, the 2-D FEM predicted only slight change in the stress in the interfacial region, giving a value close to the applied stress σ_0. As the thickness of the specimen decreased, the maximum stress decreased more rapidly, and the stress value agreed more closely with the value calculated by the 2-D FEM at a point farther from the interface.
一般社団法人日本機械学会の論文
1993-04-25