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Research and Development Center, TOSHIBA Corporation | 論文
- A Buried-Channel WN_x/W Self-Aligned GaAs MESFET with High Power-Efficiency and Low Noise-Figure for Single-Chip Front-End MMIC in Personal Handy Phone System
- Buried-Channel WN_x/W Self-Aligned GaAs MESFET Process with Selectively Implanted Channel and Undoped Epitaxial Surface Layers for MMIC Applications
- Scatterings of Shallow Threshold Voltage on Si-Implanted WN Self-Alignment Gate GaAs Metal-Semiconductor Field-Effect Transistors on Different Composition 2-Inch Substrates by Growing in Three Kinds of Furnaces
- New Features of the Metamagnetic Transition in CeRu_2Si_2 from the dHvA Effect Study under High Pressure : Condensed Matter: Electronic Properties, etc.
- dHvA Effect Study of the Metamagnetic Transition in CeRu_2Si_2 : Transition Behavior of the dHvA Oscillations
- Effects of Substrate Misorientation on Improvement of Electrical Properties in Zn-Doped InAlP Alloys
- A 1.9-GHz Direct Conversion Transmitter IC with Low Power On-Chip Frequency Doubler (Special Section on Analog Circuit Techniques and Related Topics)
- A 1.5 GHz CMOS Low Noise Amplifier
- 0.05 μm (3σ) Overlay Accuracy Through-the-lens Alignment in an Excimer Laser Lithography System
- A chromatic Aberration-Free Heterodyne Alignment for Optical Lithography : Lithography Technology
- A Chromatic Aberration-Free Heterodyne Alignment for Optical Lithography
- A New Relaxor Dielectric for High Voltage Multilayer Ceramic Capacitors with Large Capacitance
- A Lead Perovskite Y5U Dielectric for Multilayer Ceramic Capacitor : F: Ferroelectric Materials
- Cross-Language Information Access : a case study for English and Japanese
- First Experiments on the BMIR-J2 Collection using the NEAT System
- High-Density Recording Capability of Five-Layered Phase-Change Optical Disc
- Simulation of Time Decay for Photoluminescence Emitted from Silicon Crystals Excited by Short Laser Pulse
- Considerations on Future Customer Premises Network (Special Issue on Broadband ISDN : Application, Networking and Management)
- Experimental and Numerical Verification of Fatigue Life Estimation for Solder Bumps
- Thermal Fatigue Life of Solder Bumps in BGA