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Dep. Of Materials Sci. And Engineering Ibaraki Univ. | 論文
- Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
- High-Temperature Thick Al Wire Bonding Technology for High-Power Modules
- High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
- Development of A New High-Frequency, High-Peak Current Power Source for High Constricted Arc Formation
- Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms
- Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
- Joining of Oxide Dispersion Strengthened Ni Based Super Alloys
- Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires
- Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
- Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
- Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating
- Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding
- Microwave Plasma Nitriding of Hollow Tube Inner Wall
- The Low Temperature Bonding between Si and Electrode Using Sputtered Ag Films
- Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film
- Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film
- Influence of Soldering Conditions on Void Formation in Large-area Solder Joints
- The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film
- Reliability Enhancement of Solder Joints Made by a Void Free Soldering process
- Interface Reaction between Solder and Plated Nickel Film