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Anelva Corp. | 論文
- マイクロマシーン作成用の細管放電プラズマシールの特性
- マイクロマシン製造用プラズマ工具の基礎特性
- New Ultra-High-Frequency Plasma Source for Large-Scale Etching Processes
- 230% ROOM TEMPERATURE MAGNETORESISTANCE IN CoFeB/MgO/CoFeB MAGNETIC TUNNEL JUNCTIONS
- Variation of Radial Plasma Density Profile with the Excitation Frequency in a Magnetron-Type Plasma
- Modified Magnetron Type Plasma Source for Etching Applications
- Dependence of Electron Energy Distributions on Discharge Pressure in Ultrahigh-Frequency and Inductive-Coupled Cl_2 Plasmas
- Etching Characteristics by M=0 Helicon Wave Plasma ( Plasma Processing)
- Bottom Coverage of Cu Deposit for 200-nm-Class Circular Vias with High Aspect Ratios Investigated by Magnetron Sputtering Activated Using Superconducting Bulk Magnet
- Electrode Temperature Effect in Narrow-Gap Reactive Ion Etching
- Effects of Discharge Frequency on the Ion-Current Density and Etching Characteristics in High-Density Cl_2 Plasmas
- Characteristics of Etch Rate Uniformity in Aluminum Reactive Ion Etching
- Coherent Spin-Polarized Tunneling in Single-Crystal Fe/MgO/Fe Tunnel Junctions
- Magnetic Tunnel Junctions with Single-Crystal Electrodes
- Bottom Coverage of Cu Deposit for 200-nm-Class Circular Vias with High Aspect Ratios Investigated by Magnetron Sputtering Activated Using Superconducting Bulk Magnet
- Measurements of Power Absorption in a Modified Magnetron-type Discharge