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Advanced Technology Research Laboratories, Nippon Steel Corp. | 論文
- IMC Growth of Solid State Reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag Solder Bump Using Ball Place Bumping Method during Aging
- Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps
- Surface Particle Analysis of SIMOX (Separation by IMplanted OXygen) Wafers
- Analysis of Buried-Oxide Dielectric Breakdown Mechanism in Low-Dose Separation by Implanted Oxygen (SIMOX) Substrates Fabricated by Internal Thermal Oxidation (ITOX) Process
- Analysis of Buried-Oxide Dielectric Breakdown Mechanism in Low-Dose SIMOX Structures
- Evaluation of Fixed Charge and Interface Trap Densities in SIMOX Wafers and Their Effects on Device Characteristics
- Determination of Silicon in High-Silicon Electrical Steel by ICP-AES with On-line Sample Electrolytic Dissolution
- Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder
- Measurement of Carrier Concentration at the GaAs-Si Interface in GaAs on Si by Raman Scattering
- Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects
- Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
- Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition