IMC Growth of Solid State Reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag Solder Bump Using Ball Place Bumping Method during Aging
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概要
- 論文の詳細を見る
- 2005-11-20
著者
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Kono Taro
New Materials Division Nippon Steel Corp.
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HASHINO Eiji
Advanced Technology Research Laboratories, Nippon Steel Corp.
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TATSUMI Kohei
Advanced Technology Research Laboratories, Nippon Steel Corp.
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ISHIKAWA Shinji
Advanced Technology Research Laboratories, Nippon Steel Corp.
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Hashino Eiji
Advanced Technology Research Laboratories Nippon Steel Corp.
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Tatsumi Kohei
Advanced Technology Research Laboratories Nippon Steel Corp.
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Ishikawa Shinji
Advanced Technology Research Laboratories Nippon Steel Corp.
関連論文
- IMC Growth of Solid State Reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag Solder Bump Using Ball Place Bumping Method during Aging
- Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps