Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps

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2001-05-20

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関連論文

IMC Growth of Solid State Reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag Solder Bump Using Ball Place Bumping Method during Aging
Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps
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