Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2004-03-20
著者
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KIMURA Takashi
National Research Institute for Metals
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TANAKA Masamoto
Advanced Materials & Technology Research Laboratories, Nippon Steel Corporation
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TERASHIMA Shinichi
Advanced Technology Research Laboratories, Nippon Steel Corp.
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Tanaka M
Advanced Technology Research Laboratories Nippon Steel Corp.
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KARIYA Yoshiharu
National Institute for Materials Science
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HOSOI Takuya
Graduate School of Shibaura Institute of Technology
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KARIYA Yoshiharu
Eco-Materials Center, National Institute for Materials Science
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Terashima S
Advanced Technology Research Laboratories Nippon Steel Corp.
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Terashima Shinichi
Advanced Technology Research Laboratories Nippon Steel Corp.
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Kariya Yoshiharu
Eco-materials Center National Institute For Materials Science
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Kimura Takashi
National Agricultural Res. Center For Kyushu Okinawa Region National Agriculture And Food Res. Organ
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Kimura Takashi
National Institute For Materials Science
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