Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2004-03-20
著者
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TANAKA Masamoto
Advanced Materials & Technology Research Laboratories, Nippon Steel Corporation
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TERASHIMA Shinichi
Advanced Technology Research Laboratories, Nippon Steel Corp.
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Tanaka M
Advanced Technology Research Laboratories Nippon Steel Corp.
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KARIYA Yoshiharu
Eco-Materials Center, National Institute for Materials Science
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Terashima S
Advanced Technology Research Laboratories Nippon Steel Corp.
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Terashima Shinichi
Advanced Technology Research Laboratories Nippon Steel Corp.
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Kariya Yoshiharu
Eco-materials Center National Institute For Materials Science
関連論文
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- Study of YBa_2Cu_3 O_7 Superconductor by Low-Temperature Scanning Tunneling Microscopy and Spectroscopy
- Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder
- Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects
- Measurement of Elastic Moduli by Rectangular Parallelepiped Resonance Method : Physical Acoustics
- Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
- Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition