Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2004-04-20

著者

• TANAKA Masamoto

  Advanced Materials & Technology Research Laboratories, Nippon Steel Corporation

• Nozaki Masako

  Nippon Steel Techno Research Corp.

• TERASHIMA Shinichi

  Advanced Technology Research Laboratories, Nippon Steel Corp.

• TAKAHAMA Keiko

  Nippon Steel Techno Research Corp.

• Terashima Shinichi

  Advanced Technology Research Laboratories Nippon Steel Corp.

関連論文

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• Study of YBa_2Cu_3 O_7 Superconductor by Low-Temperature Scanning Tunneling Microscopy and Spectroscopy
• Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder
• Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects
• Measurement of Elastic Moduli by Rectangular Parallelepiped Resonance Method : Physical Acoustics
• Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
• Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition

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