Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2004-03-20
著者
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TANAKA Masamoto
Advanced Materials & Technology Research Laboratories, Nippon Steel Corporation
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Tanaka Masamoto
Advanced Technology Research Laboratories Nippon Steel Corp.
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TERASHIMA Shinichi
Advanced Technology Research Laboratories, Nippon Steel Corp.
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Terashima Shinichi
Advanced Technology Research Laboratories Nippon Steel Corp.
関連論文
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- Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder
- Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects
- Measurement of Elastic Moduli by Rectangular Parallelepiped Resonance Method : Physical Acoustics
- Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
- Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition