Wu Wen-fa | National Nano Device Laboratories
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概要
関連著者
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Wu Wen-fa
National Nano Device Laboratories
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Lee Jain-tsai
Department Of Materials Science And Engineering National Chiao-tung University
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TSAI Kou-Chiang
Department of Materials Science and Engineering, National Chiao Tung University
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CHAO Chuen-Guang
Department of Materials Science and Engineering, National Chiao-Tung University
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Chao Chuen-guang
Department Of Material Sciences And Engineering National Chiao Tung University
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Kang Tsung-kuei
Department Of Electronic Engineering Feng-chia University
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Wu Chi-chang
Department Of Electronic Engineering Feng-chia University
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CHIOU Bi-Shiou
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University
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Chao Chuen-guang
Department Of Materials Science And Engineering National Chiao-tung University
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Chiou B‐s
Department Of Electronics Engineering And Institute Of Electronics National Chiao Tung University
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Chin Y‐l
National Chiao Tung Univ. Hsinchu Twn
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Chiou Bi-shiou
Department Of Electronics Engineering And Institute Of Electronics National Chiao Tung University
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CHIN Yu-Lung
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University,
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TSAI Kou-Chiang
National Nano Device Laboratories
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HSU Jwo-Lun
National Nano Device Laboratories
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Chin Yu-lung
Department Of Electronics Engineering And Institute Of Electronics National Chiao Tung University
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Lin Cheng-li
Department of Electronic Engineering, Feng Chia University, Taichung, Taiwan 407, Republic of China
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SHEN Shih-Wen
National Nano Device Laboratory
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Jheng Guo-shen
Department Of Electronic Engineering National Yunlin University Of Science And Technology
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Shen Shih-wen
National Nano Device Laboratories
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Liao Ta-chuan
Department Of Electronics Engineering And Institute Of Electronics National Chiao Tung University
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CHANG Wei-Che
Department of Electronic Engineering, Feng-Chia University
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KANG Tsung-Kuei
Department of Electronic Engineering, Feng-Chia University
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LIN Jian-Yang
Department of Electronic Engineering, National Yunlin University of Science and Technology
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KUAN Cheng-Ping
National Nano Device Laboratories
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WU Chi-Chang
National Nano Device Laboratories
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Lin Jian-yang
Department Of Electronic Engineering National Yunlin University Of Science And Technology
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Chen Chao-wen
Department Of Agronomy National Taiwan University
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Wu Wen-Fa
National Nano Device Laboratories, No. 26 Prosperity Road 1, Science-based Industrial Park, Hsinchu, Taiwan, Republic of China
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Shen Shih-Wen
National Nano Device Laboratories, No. 26 Prosperity Road 1, Science-based Industrial Park, Hsinchu, Taiwan, Republic of China
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Kang Tsung-Kuei
Department of Electronic Engineering, Feng-Chia University, Taichung, Taiwan 40724, R.O.C.
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Liao Ta-Chuan
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan 30010, R.O.C.
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Tsai Kou-Chiang
Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, Republic of China
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Lee Jain-Tsai
Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, Republic of China
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Lin Cheng-Li
Department of Electronic Engineering, Feng-Chia University, Taichung, Taiwan 40724, R.O.C.
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Hsu Jwo-Lun
National Nano Device Laboratories, No. 26 Prosperity Road 1, Science-based Industrial Park, Hsinchu, Taiwan, Republic of China
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Lin Jian-yang
Department of Electrical Engineering, National Chung Cheng Institute of Technology
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Chen Chao-Wen
Department of Electronic Engineering, Feng-Chia University, Taichung, Taiwan 407, R.O.C.
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Wu Wen-Fa
National Nano Device Laboratories, Hsinchu, Taiwan 30078, R.O.C.
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Chao Chuen-Guang
Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, Republic of China
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Kang Tsung-Kuei
Department of Electronic Engineering, Feng-Chia University, Taichung, Taiwan 407, R.O.C.
著作論文
- Effect of the Tantalum Barrier Layer on the Electromigration and Stress Migration Resistance of Physical-Vapor-Deposited Copper Interconnect
- Effect of Aluminum Seed Layer on the Crystallographic Texture and Electromigration Resistance of Physical Vapor Deposited Copper Interconnect
- Impacts of Cu/TaN Electrode on the Electrical Properties of Metal-insulator-metal (Ba,Sr)TiO_3 Thin-film Capacitors
- Improving Electrical Properties and Thermal Stability of (Ba,Sr)TiO_3 Thin Films on Cu(Mg) Bottom Electrodes
- Repairing of Etching-Induced Damage of High-k Ba_Sr_TiO_3 Thin Films by Oxygen Surface Plasma Treatment
- Improving Characteristics of Tantalum Oxide Thin Film Devices with Copper Electrodes
- Effect of Nitrogen Plasma Treatment on Electrical Characteristics for Pd Nanocrystals in Nonvolatile Memory
- Effect of Thermal Annealing or Plasma Treatment on Analog Characteristics for High-$k$ Material Capacitors
- Improving Electrical Properties and Thermal Stability of (Ba,Sr)TiO3 Thin Films on Cu(Mg) Bottom Electrodes
- Repairing of Etching-Induced Damage of High-$k$ Ba0.5Sr0.5TiO3 Thin Films by Oxygen Surface Plasma Treatment