Chin Y‐l | National Chiao Tung Univ. Hsinchu Twn

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概要

• 同名の論文著者
• National Chiao Tung Univ. Hsinchu Twnの論文著者

関連著者

• Chin Y‐l

  National Chiao Tung Univ. Hsinchu Twn

• Wu Wen-fa

  National Nano Device Laboratories

• CHIOU Bi-Shiou

  Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University

• Chiou B‐s

  Department Of Electronics Engineering And Institute Of Electronics National Chiao Tung University

• Chiou Bi-shiou

  Department Of Electronics Engineering And Institute Of Electronics National Chiao Tung University

• CHIN Yu-Lung

  Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University,

• Chin Yu-lung

  Department Of Electronics Engineering And Institute Of Electronics National Chiao Tung University

• Hsiung S‐k

  Chung Yuan Christian Univ. Chung‐li Twn

• Hsiung Shen-kan

  Institute Of Electronic Engineering Chung Yuan Christian University

• Chou J‐c

  National Yunlin Univ. Sci. And Technol. Yunlin Twn

• CHOU Jung-Chuan

  Institute of Electronics, National Chiao Tung University

• Chiang Jung-lung

  Department Of Electronic Engineering Chung Chou Institute Of Technology

• Sun T‐p

  Institute Of Electrical Engineering National Chi Nan University

• Chung W‐y

  Institute Of Electronic Engineering Chung Yuan Christian University

• CHIN Yuan-Lung

  Institute of Electronic Engineering, Chung Yuan Christian University

• LET Zhen-Ce

  Institute of Electronic Engineering, Chung Yuan Christian University

• SUN Tai-Ping

  Institute of Electrical Engineering, National Chi Nan University

• CHUNG Wen-Yaw

  Institute of Electronic Engineering, Chung Yuan Christian University

• Let Zhen-ce

  Institute Of Electronic Engineering Chung Yuan Christian University

• Chou Jung-chuan

  Institute Of Electronic And Information Engineering National Yunlin University Of Science And Techno

• Lei Zhen-Ce

  Institute of Electronic Engineering, Chung Yuan Christian University

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著作論文

• Effect of the Tantalum Barrier Layer on the Electromigration and Stress Migration Resistance of Physical-Vapor-Deposited Copper Interconnect
• Effect of Aluminum Seed Layer on the Crystallographic Texture and Electromigration Resistance of Physical Vapor Deposited Copper Interconnect
• Titanium Nitride Membrane Application to Extended Gate Field Effect Taansistor pH Sensor Using VLSI Technology : Semiconductors

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