Hong X | Department Of Computer Science And Technology Tsinghua University

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概要

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著作論文

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation
A Novel Timing-Driven Global Routing Algorithm Considering Coupling Effects for High Performance Circuit Design(Place and Routing)(VLSI Design and CAD Algorithms)
VLSI Module Placement with Pre-Placed Modules and with Consideration of Congestion Using Solution Space Smoothing(Place and Routing)(VLSI Design and CAD Algorithms)
A Novel Timing-Driven Global Routing Algorithm Considering Coupling Effects for High Performance Circuit Design
VLSI Module Placement with Pre-Placed Modules and with Consideration of Congestion Using Solution Space Smoothing
VLSI Floorplanning with Boundary Constraints Using Corner Block List Representation(Special Section on VLSI Design and CAD Algorithms)
A Fast Decoupling Capacitor Budgeting Algorithm for Robust On-Chip Power Delivery(Physical Design)(VLSI Design and CAD Algorithms)
Timing-Driven Global Routing with Efficient Buffer Insertion(VLSI Design Technology and CAD)
Partial Random Walks for Transient Analysis of Large Power Distribution Networks(Physical Design)(VLSI Design and CAD Algorithms)
Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs

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