Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling (Special Issue : Solid State Devices and Materials (2))
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
著者
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Ueda Toshitsugu
Graduate School Of Information Production And Systems Waseda Univ.
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Shi Hongbin
Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan
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Tian Cuihua
Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan
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