Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills (Special Issue : Advanced Metallization for ULSI Applications)
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概要
著者
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Ueda Toshitsugu
Graduate School Of Information Production And Systems Waseda Univ.
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Shi Hongbin
Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan
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Tian Cuihua
Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan
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