Tian Cuihua | Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan

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概要

• 同名の論文著者
• Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japanの論文著者

関連著者

• Ueda Toshitsugu

  Graduate School Of Information Production And Systems Waseda Univ.

• Shi Hongbin

  Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan

• Tian Cuihua

  Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan

著作論文

• Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills (Special Issue : Advanced Metallization for ULSI Applications)
• Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling (Special Issue : Solid State Devices and Materials (2))

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