Scaling Trends and Tradeoffs between Short Channel Effect and Channel Boosting Characteristics in Sub-20 nm Bulk/Silicon-on-Insulator NAND Flash Memory
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概要
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The scaling trends and limitation in sub-20 nm a bulk and silicon-on-insulator (SOI) NAND flash memory is studied by the three-dimensional (3D) device simulation focusing on short channel effects (SCE), channel boost leakage and channel voltage boosting characteristics during the program-inhibit operation. Although increasing punch-through stopper doping concentration is effective for suppressing SCE in bulk NAND cells, the generation of junction leakage becomes serious. On the other hand, SCE can be suppressed by thinning the buried oxide (BOX) in SOI NAND cells. However, the boosted channel voltage decreases by the higher BOX capacitance. It is concluded that the scaling limitation is dominated by the junction leakage and channel boosting capability for bulk and SOI NAND flash cells, respectively, and the scaling limit is decreased to 9 nm using SOI NAND flash memory cells from 13 nm in bulk NAND flash memory cells.
- 2012-04-25
著者
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Takeuchi Ken
Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo, Tokyo 113-8656, Japan
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Miyaji Kousuke
Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Hung Chinglin
Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Miyaji Kousuke
Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo, Tokyo 113-8656, Japan
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Takeuchi Ken
Department of Electrical Engineering and Information Systems, Chuo University, Bunkyo, Tokyo 112-8551, Japan
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