Aging Influence of Poly(ethylene glycol) Suppressors of Cu Electrolytes on Gaps Filling
スポンサーリンク
概要
- 論文の詳細を見る
In this study, we investigate how the degradation of poly(ethylene glycol) (PEG) additives in Cu electroplating electrolytes influences the gaps filling of damascene features and the roughness of plated surfaces. The cleavage of PEG, whose reaction is enhanced by a high bias current and more plating cycles, not only diminishes the inhibition effect of the electrolytes, but also enables the formation of enormous complexes of short-chain PEG–Cu far from the reacting surfaces. Hence, the more plating cycles performed, the worse the gaps filling characteristic and the rougher the plated surfaces. Furthermore, an overshoot phenomenon on the transient cells voltage for PEG-containing electrolytes is observed and explained well by a dynamic equilibrium between PEG absorption ability and Cu reduction speed. Accordingly, the change in overshoot shape is closely related to PEG aging and this fact is employed to examine the reliability of electrolytes.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2006-05-15
著者
-
Dai Bau-tong
National Nano Device Lab.
-
SHIEH Jia-Min
National Nano Device Laboratories
-
Chen Chih
Department Of Mechanical Engineering Da-yeh University
-
Li Tsung-Cheng
Department of Material Science and Engineering, National Chiao Tung University, Hsinchu 30050, Taiwan, R.O.C.
-
Liu Sue-Hong
Department of Material Science and Engineering, National Chiao Tung University, Hsinchu 30050, Taiwan, R.O.C.
-
Cheng Shih-Song
BASF Electronic Materials Limited, Taipei, Taiwan, R.O.C.
-
Hensen Karl
BASF Electronic Materials Limited, Taipei, Taiwan, R.O.C.
-
Shieh Jia-Min
National Nano Device Laboratories, Hsinchu 30078, Taiwan, R.O.C.
-
Dai Bau-Tong
National Nano Device Laboratories, Hsinchu 30078, Taiwan, R.O.C.
-
Chen Chih
Department of Electronic Engineering, Feng-Chia University, Taichung 407, Taiwan
関連論文
- Pattern Effects on Planarization Efficiency of Cu Electropolishing
- Investigation of Carrying Agents on Microstructure of Electroplated Cu Films
- Investigation of Superfihling and Electrical Characteristics in Low-Impurity-Incorporated Cu Metallization
- Microwave Heating for the Preparation of Nanometer Gold Particles
- Synthesis of Nanometer-Sized Poly (methyl methacrylate) Polymer Network by Gold Nanoparticle Template
- Plasma Treatment and Dry Etch Characteristics of Organic Low-k Dielectrics
- Effects of Helicon-Wave-Plasma Etching on the Charging Damage of Aluminum Interconnects
- Charging Damages to Gate Oxides in a Helicon O_2 Plasma
- Antenna Charging Effects on the Electrical Characteristics of Polysilicon Gate during Electron Cyclotron Resonance Etching
- Effects of Polysilicon Electron Cyclotron Resonance Etching on Electrical Characteristics of Gate Oxides
- Combination of Chemical Mechanical Polishing and Ultrahigh Vacuum Chemical Vapor Deposition Techniques to Fabricate Polycrystalline Thin Film Transistors
- Optical Nonlinearity and Ultrafast-Carrier Dynamics of a Strained Quantum-Well Saturable Bragg Reflector
- DESIGN AND DSP IMPLEMENTATION OF ACTIVE VIBRATION CONTROLLER FOR ISOLATION PLATFORM
- The Fuzzy Control of the Unknown Obstacles Avoidance for the Mobile Robots
- Optical Nonlinearity and Ultrafast-Carrier Dynamics of a Strained Quantum-Well Saturable Bragg Reflector
- Synthesis and Characteristics of Fe Nanowires
- Aging Influence of Poly(ethylene glycol) Suppressors of Cu Electrolytes on Gaps Filling
- Microwave Heating for the Preparation of Nanometer Gold Particles
- Synthesis of Nanometer-Sized Poly (methyl methacrylate) Polymer Network by Gold Nanoparticle Template
- Low Temperature Synthesis of Single Crystalline Silicon Nanowires Using Anodic Aluminum Oxide Template