Low-Temperature Fabrication of Nickel Silicide Metal Oxide Semiconductor Capacitors at 280 °C by Metal Chloride Reduction Chemical Vapor Deposition

概要

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We have successfully fabricated nickel silicide metal–oxide–semiconductor (MOS) capacitors at 280 °C by metal chloride reduction chemical vapor deposition (MCR-CVD). In this process, we first prepared polycrystalline silicon (poly-Si)/SiO2-overcoated Si wafers and exposed the wafers to Cl plasma containing NiCl for 40 min with a substrate temperature of 280 °C. During this process, the top layer of poly-Si is changed to a nickel silicide film with the Ni concentration at approximately 50%. Depth-resolved X-ray photoelectron spectroscopy (XPS) showed a uniform profile of the top film and a sharp interface on the SiO2 surface at such Ni concentration. We have also obtained capacitance–voltage ($C$–$V$) characteristics using a MOS capacitor from the processed wafer. We demonstrate the possibility and applicability of MCR-CVD in the near room temperature (RT) fabrication of metal gate MOS capacitors.
Japan Society of Applied Physicsの論文
2007-06-25