Structural Evaluation of Cu Films Grown by Cl2 Plasma

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概要

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• We evaluated the morphology and crystallinity of copper films which were grown by the new chemical vapor deposition (CVD) method with Cl2 plasma using field emission scanning electron microscopy (FESEM) and electron back scattering pattern (EBSP). The obtained films consisted of large grains of 0.5–1 μm size, and filling with high crystallinity was indicated. Moreover, we observed the time evolution of the morphology of the films by FESEM. On the basis of the results, the mechanism of the copper film growth and the bottom-up filling by the new CVD method was discussed.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2003-11-15

著者

• Ogura Yuzuru

  Mitsubishi Heavy Industries Ltd. Advanced Technology Research Center

• Yahata Naoki

  Mitsubishi Heavy Industries, Ltd., Advanced Technology Research Center, 1-8-1 Sachiura, Kanazawa-ku, Yokohama 236-8515, Japan

• Nishimori Toshihiko

  Mitsubishi Heavy Industries, Ltd., Takasago Research & Development Center, 2-1-1 Shinhama Arai-cho, Takasago 676-8686, Japan

• Ohba Yoshiyuki

  Mitsubishi Heavy Industries, Ltd., Advanced Technology Research Center, 1-8-1 Sachiura, Kanazawa-ku, Yokohama 236-8515, Japan

• Sakamoto Hitoshi

  Mitsubishi Heavy Industries, Ltd., Advanced Technology Research Center, 1-8-1 Sachiura, Kanazawa-ku, Yokohama 236-8515, Japan

• Hatayama Kenichiro

  World Intec Co., Ltd., 1-8-1 Sachiura, Kanazawa-ku, Yokohama 236-8515, Japan

関連論文

• Low-Temperature Fabrication of Nickel Silicide Metal Oxide Semiconductor Capacitors at 280 °C by Metal Chloride Reduction Chemical Vapor Deposition
• Structural Evaluation of Cu Films Grown by Cl2 Plasma

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