Effect of reflector bias voltage on the nanocrystallization of silicon thin films by reactive particle beam assisted chemical vapor deposition
スポンサーリンク
概要
- 論文の詳細を見る
In the present study, the effects of reflector bias voltage on the physical and chemical properties of nanocrystalline silicon deposited by reactive particle beam assisted chemical vapor deposition were systematically studied using various reflector bias voltages. During deposition, the substrate temperature was kept at room temperature. Nanocrystalline Si embedded in an amorphous matrix structure was analyzed by X-ray diffraction and Raman spectroscopy. Films that were deposited under high reflector voltage formed large grains due to largely accumulated internal energy. Using X-ray photoelectron spectroscopy, the chemical state of nanocrystalline silicon was revealed to have only metallic Si bonds. Further, an increase in reflector voltage induced a roughened surface morphology, an increased dark conductivity, and a decreased optical band gap in Si films.
著者
関連論文
- Recovery of Silicon Surface after Reactive Ion Etching of SiO_2 using CHF_3/C_2F_6 Plasma
- Size effect of substitutional alkaline-earth elements on the electrical and structural properties of LaMnO3 films
- Energy Level Structure of Amorphous Silicon Carbide
- Infrared-Cut Filter : Optics and Quantum Electronics
- Etching Characteristics and Mechanism of ZnO and Ga-Doped ZnO Thin Films in Inductively Coupled HBr/Ar/CHF3 Plasma
- Etching Characteristics of In2O3 and SnO2 Thin Films in an Inductively Coupled HBr/Ar Plasma: Effects of Gas Mixing Ratio and Bias Power
- Etching Characteristics of VO2 Thin Films Using Inductively Coupled Cl2/Ar Plasma
- Kinetics of Chemical Changes in Phenol Formaldehyde Based Polymeric Films Etched in N2O and O2 Inductively Coupled Plasmas: A Comparative Study
- Effect of Gas Mixing Ratio on Etch Behavior of Y2O3 Thin Films in Cl2/Ar and BCl3/Ar Inductively Coupled Plasmas
- Etching Characteristics and Mechanism of InP in Inductively Coupled HBr/Ar Plasma
- Etching Characteristics of Manganese-Doped Zinc Sulfide Film Using Cl2/CF4 Inductively Coupled Plasma
- Etching Characteristics and Mechanisms of Pb(Zr,Ti)O3, Pt, and SiO2 in an Inductively Coupled HBr/Cl2 Plasma
- Etching Characteristics and Mechanisms of TiO2 Thin Films in HBr/Cl2/Ar Inductively Coupled Plasma
- Etching Behavior and Mechanism of In- and Ga-Doped ZnO Thin Films in Inductively Coupled BCl3/Cl2/Ar Plasmas
- Influence of Ar and NH3 Plasma Treatment on Surface of Poly(monochloro-para-xylylene) Dielectric Films Processed in Oxygen Plasma
- A Multimode Relayed Piezoelectric Cantilever for Effective Vibration Energy Harvesting
- Effect of reflector bias voltage on the nanocrystallization of silicon thin films by reactive particle beam assisted chemical vapor deposition