精密3点曲げ法による電子デバイス用薄膜のヤング率測定

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This paper describes the Youngs modulus of thin films for electronic devices measured by a 3-points bending method. Materials tested were rolled copper, electrolytic copper, direct current plated copper and pulse plated copper and liquid crystal polymer films. Youngs moduli were calculated from the difference in the slope of the load-deflection line between aluminum substrate and that with the glued film. The direct current plated copper showed the largest Youngs modulus among the copper films. The Youngs modulus of the pulse plated copper was larger than those of the rolled copper and electrolytic copper. However, the Youngs moduli of all the copper films were smaller than that of bulk copper. The difference of Youngs modulus of the copper films was discussed in relation to the residual stress and crystal structure of the films observed by EBSP. The Youngs modulus of the liquid crystal polymer was smaller than those of the copper films. Anisotropy of the Youngs modulus was found in the liquid crystal polymer film, i.e. the injection direction showed the smaller Youngs modulus compared with the transverse direction to it.