電子デバイス用薄膜のヤング率測定用精密3点曲げ試験装置の開発と測定例

概要

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This paper describes the precision three-points bending machine developed for measuring Young's modulus of thin films used for electronic devices. The developed machine has 0.05 μm displacement and 9.8×10^<-6> N load resolution. The Young's modulus of 200 μm glass plate in thickness measured by the machine agreed with that of the published value within 3% difference, which shows that the machine has a sufficient performance and reproducibility of the data. The Young's moduli of sputtered Co-Ta-Zr amorphous thin films, of which thickness were ranged from 1 μm to 10 μm, were measured. The Young's moduli of the thin films thicker than 4.5 μm showed a constant value of 150 GPa, but those smaller than 4.5 μm in thickness increased with decreasing film thickness. The Young's modulus of 1 μm in thickness showed a value of 250 GPa which is about 70% larger than that of 10 μm in thickness. The Young's moduli measured for the films more than 4.5 μm in thickness well agreed with the bulk Young's modulus of amorphous Co alloy.
社団法人日本材料学会の論文
1994-06-15