T1602-2-1 円筒面上での反応性イオンエッチング技術の開発([T1602-2]マイクロナノ理工学:nmからmmまでの表面制御とその応用(2))

概要

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We have proposed a novel reactive ion etching (RIE) method to etch a cylindrical work (tube) deeply and vertically from its cylindrical surface. In order to achieve this method, we have developed a cylindrical RIE (Cyl-RIE) equipment having a columnar electrode. This electrode attracts ions in plasma by self-bias voltage, and the ions enter to this electrode. Also, We developed the flexible stencil mask which can be directly attached on a cylindrical work surface. It is made from polyimide film. This mask has three-block (Upper, Middle, Lower pattern) arrangement of line and space (L&S) pattern for the evaluation. We evaluated the etching characteristics of Cyl-RIE. Poly lactic acid (PLA) tube and oxygen gas were used as etching sample and etching gas, respectively. As a result, the etching direction was vertical to the surface and the vertical walls were fabricated, i.e. we were able to achieve anisotropic vertical etching by Cyl-RIE.
一般社団法人日本機械学会の論文
2010-09-04