J0404-8-3 成形加工金型内臓センサーの開発([J0404-8]知的材料・構造システム(8):各種センシング)

概要

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Micro-sensor that embedded in die was fabricated by using semiconductor processing technology. A sensing system for V-bending process was developed and its characteristics were evaluated. The influent factors on sensing accuracy were investigated. Sensitivity of micro sensor was very high, and the process parameters, such as stress distribution, bend angle, can be monitored from multi sensors allocated on one sensor chip in-process. However, it is found that the accuracy of sensor embedding and joining processes influence on the sensor properties significantly. A novel process in which the micro sensor was deposited on the die surface directly using 3D photolithography process was proposed as an alternate method.
一般社団法人日本機械学会の論文
2010-09-04