324 ワイヤソーを用いた精密微細切断の研究(OS-16 微細加工と表面機能)

概要

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Recently, many cut off processes are research and development. In the production process such as the silicon wafer or the crystal resonator, the multi-wire saw is often used. But, the cut off in free form is difficult by this method. In the case of free form cutting, wire EDM, laser cutting and waterjet machining are properly used by work material and work thickness, etc. In other words, the wire EDM is not adapted for non-conducting material, and it is difficult by the laser cutting and the waterjet machining that the thick workpiece is cut off with thin cutting width. So, the author proposes free form cut off method using diamond abrasive wire for non-conductive material such as optical glass. In this research, concept of proposal method and development of cut off unit for initial experiment are reported.
社団法人日本機械学会の論文
2006-11-24