Investigation of wafer warpage resulted from deep trench isolation in multi-layered SOI (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))

スポンサーリンク

概要

• 論文の詳細を見る

• In this paper, the wafer warpage that originated from the stress of DTI(deep trench isolation) is investigated. The wafer warpage resulted from oxide filled DTI with 4μm width and 40μm depth is simulated and measured. The DTI using mixed layer of 1μm thermal oxide and 0.8μm poly silicon is also considered. The wafer warpages from the room temperature to 500℃ are measured and analyzed. It is verified that the main source of the wafer warpage is the thermal stress. The wafer warpages of these DTIs at the room temperature are simulated and compared with the measured values. The difference between two values is less than 5%.

• 社団法人電子情報通信学会の論文
• 2007-06-18

著者

• CHUN Kukjin

  School of Electrical Engineering and Inter-university Semiconductor Research Center (ISRC), Seoul Na

• Chun Kukjin

  School Of Electrical Engineering And Computer Science #038 And Inter-university Semiconductor Resear

• Chun Kukjin

  Seoul National Univ. Seoul Kor

• Kim Hyeon

  School Of Electrical Engineering And Computer Science Seoul National University

• JEONG Jinwoo

  School of Electrical Engineering and Computer Science, Seoul National University

• Jeong Jinwoo

  School Of Electrical Engineering And Computer Science Seoul National University

• Kim Hyeon

  School Of Computer And Software Eng. Kumoh National University Of Technology

• Kim Hyeon

  Seoul National Univ. Seoul Kor

関連論文

• A Complementary Metal Oxide Semiconductor (CMOS) Compatible Capacitive Silicon Accelerometer with Polysilicon Rib-Style Flexures
• The Novel Deflector for Multi Arrayed Microcolumn Using Microelectromechanical System (MEMS) Technology
• The Multi Arrayed Micro-scale Electron Optical System for Electron Beam Lithography using MEMS Technology
• The Multi Arrayed Micro-scale Electron Optical System for Electron Beam Lithography using MEMS Technology
• Simulation of High Energy E-beam Lithography for Nano-Patterning : A Development of E-beam Lithography Simulator(Session A8 Nano-Lithography)(2004 Asia-Pasific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))
• Simulation of High Energy E-beam Lithography for Nano-Patterning : A Development of E-beam Lithography Simulator(Session A8 Nano-Lithography)(2004 Asia-Pasific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))
• Simulation of High Energy E-beam Lithography for Nano-Patterning : A Development of E-beam Lithography Simulator
• Simulation of High Energy E-beam Lithography for Nano-Patterning : A Development of E-beam Lithography Simulator
• Investigation of wafer warpage resulted from deep trench isolation in multi-layered SOI (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
• Investigation of wafer warpage resulted from deep trench isolation in multi-layered SOI (Silicon devices and materials: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
• A Small Size Dual-band MEMS Antenna using LC Resonators(Session 8B Emerging Devices and Technologies II,AWAD2006)
• A Small Size Dual-band MEMS Antenna using LC Resonators(Session 8B Emerging Devices and Technologies II)
• RF MEMS Technology
• Fabricaton of Poly(dimethylsiloxane) Microlens for Laser-Induced Fluorescence Detection
• Potential of Thermo-Sensitive Hydrogel as an Actuator
• Monolithic VCOs with High Q MEMS Inductors for RF Applications (Devices:先端デバイスの基礎と応用に関するアジアワークショップ)
• A Morphology-independent Wafer Level Rivet Packaging with LEGO-like Assembly (先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))
• A Morphology-independent Wafer Level Rivet Packaging with LEGO-like Assembly (先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))
• Monolithic VCOs with High Q MEMS Inductors for RF Applications (Devices:先端デバイスの基礎と応用に関するアジアワークショップ)
• Cantilever-Type Microelectromechanical Systems Probe Card with Through-Wafer Interconnects for Fine Pitch and High-Speed Testing
• Construction of Global State Transition Graph for Verifying Specifications Written in Message Sequence Charts for Telecommunications Software
• Potential of Thermo-Sensitive Hydrogel as an Actuator
• New DC Arc Discharge Synthesis Method for Carbon Nanotubes Using Xylene Ferrocene as Floating Catalyst
• The Novel Deflector for Multi Arrayed Microcolumn Using Microelectromechanical System (MEMS) Technology

もっと見る 閉じる

スポンサーリンク