Cantilever-Type Microelectromechanical Systems Probe Card with Through-Wafer Interconnects for Fine Pitch and High-Speed Testing
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概要
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A new microelectromechanical systems (MEMS) probe card made of electroplated nickel cantilevers, which has compliant structure, with through-wafer interconnections for IC testing is developed. The measured contact resistance was less than 0.5 ohm and leakage current was approximately 0.13 nA between tips and pads. In addition, planarity of tips and the alignment of $x$- and $y$-axes were satisfied with conventional needle probe card performance. Therefore, this probe card is suitable for wafer-level burn-in testing and function testing of memory and RF devices. In particular, since through-wafer interconnection can offer the shortest signal line path and reduce signal delay, it is possible to implement fine pitch and high-speed devices. The probe was fabricated with the 4-inch silicon substrate.
- 2004-06-15
著者
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Chun Kukjin
School Of Electrical Engineering And Computer Science #038 And Inter-university Semiconductor Resear
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Kim Hyun-chul
School Of Electrical Engineering Seoul National University
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Tak Yongsug
Department Of Chemical Engineering Inha University
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Kim Bong-Hwan
School of Electrical Engineering, Seoul National University ENG420-038, Kwanak P.O. Box 34, Seoul 151-744, Korea
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Ki Junghee
Department of Chemical Engineering, Inha University, 253, Younghyun-dong, Nam-gu, Incheon, 402-752, Korea
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Chun Kukjin
School of Electrical Engineering, Seoul National University ENG420-038, Kwanak P.O. Box 34, Seoul 151-744, Korea
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Tak Yongsug
Department of Chemical Engineering, Inha University, 253, Younghyun-dong, Nam-gu, Incheon, 402-752, Korea
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