Chun Kukjin | School Of Electrical Engineering And Computer Science #038 And Inter-university Semiconductor Resear

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概要

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著作論文

A Complementary Metal Oxide Semiconductor (CMOS) Compatible Capacitive Silicon Accelerometer with Polysilicon Rib-Style Flexures
The Novel Deflector for Multi Arrayed Microcolumn Using Microelectromechanical System (MEMS) Technology
The Multi Arrayed Micro-scale Electron Optical System for Electron Beam Lithography using MEMS Technology
The Multi Arrayed Micro-scale Electron Optical System for Electron Beam Lithography using MEMS Technology
Simulation of High Energy E-beam Lithography for Nano-Patterning : A Development of E-beam Lithography Simulator(Session A8 Nano-Lithography)(2004 Asia-Pasific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))
Simulation of High Energy E-beam Lithography for Nano-Patterning : A Development of E-beam Lithography Simulator(Session A8 Nano-Lithography)(2004 Asia-Pasific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))
Simulation of High Energy E-beam Lithography for Nano-Patterning : A Development of E-beam Lithography Simulator
Simulation of High Energy E-beam Lithography for Nano-Patterning : A Development of E-beam Lithography Simulator
Investigation of wafer warpage resulted from deep trench isolation in multi-layered SOI (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
Investigation of wafer warpage resulted from deep trench isolation in multi-layered SOI (Silicon devices and materials: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
A Small Size Dual-band MEMS Antenna using LC Resonators(Session 8B Emerging Devices and Technologies II,AWAD2006)
A Small Size Dual-band MEMS Antenna using LC Resonators(Session 8B Emerging Devices and Technologies II)
RF MEMS Technology
Fabricaton of Poly(dimethylsiloxane) Microlens for Laser-Induced Fluorescence Detection
Potential of Thermo-Sensitive Hydrogel as an Actuator
Monolithic VCOs with High Q MEMS Inductors for RF Applications (Devices:先端デバイスの基礎と応用に関するアジアワークショップ)
A Morphology-independent Wafer Level Rivet Packaging with LEGO-like Assembly (先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))
A Morphology-independent Wafer Level Rivet Packaging with LEGO-like Assembly (先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))
Monolithic VCOs with High Q MEMS Inductors for RF Applications (Devices:先端デバイスの基礎と応用に関するアジアワークショップ)
Cantilever-Type Microelectromechanical Systems Probe Card with Through-Wafer Interconnects for Fine Pitch and High-Speed Testing
Potential of Thermo-Sensitive Hydrogel as an Actuator
The Novel Deflector for Multi Arrayed Microcolumn Using Microelectromechanical System (MEMS) Technology

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