電子部品における鉛フリーはんだのウィスカー発生・成長の防止に関する研究(オーガナイズドセッション,材料と組織)

概要

論文の詳細を見る
A purpose of this research is to prevent the whisker being generated. To clarify the generation factor of the whisker, the generation examination of whisker was done with a designed examination treatment device. The result of obtaining is as follows; (l)The whisker was able to be generated by the examination treatment device proposed by this research. (2)It was observed that many whiskers had been generated from the location where plating had transformed plasticity by tightening the bolt, and it had not been generated from other locations by using SEM. (3) An external compression stress influences the growth of the whisker very greatly. One of the important point of the whisker prevention is not to cause the compression stress in the solder plating.
2004-09-23